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天津中环半导体股份有限公司
ACTIVE
LEI: 300300Y3UHPAM1FB1Y03
LAPSED
China, 西青区, 天津新技术产业园区华苑产业区(环外)海泰东路12号, 100000
Legal Name
天津中环半导体股份有限公司
Registered At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统国家市场监督管理总局
China, China
RA000092
Registration Authority Entity ID
911200001034137808
Legal Jurisdiction
CN
Entity Category
GENERAL
Entity Legal Form Code
企业 (zh)
ECAK
Entity Status
ACTIVE
Entity Created At
2012-01-01
Addresses
Legal Address
天津新技术产业园区华苑产业区(环外)海泰东路12号
100000
西青区
CN-TJ
CN | China
Headquarters Address
天津新技术产业园区华苑产业区(环外)海泰东路12号
100000
西青区
CN-TJ
CN | China
Registration Details
LEI Initial Registration Date
2020-03-26
LEI Last Update Date
2023-02-21
LEI Registration Status
LAPSED
LEI Next Renewal Date
2024-02-21
Managing LOU
北京国家金融标准化研究院有限责任公司 (北京国家金融标准化研究院有限责任公司)
Validation Sources
FULLY_CORROBORATED
Validated At
National Enterprise Credit Information Publicity System (State Administration for Market Regulation)
全国企业信用信息公示系统国家市场监督管理总局
China, China
RA000092
Validated As
911200001034137808
Relationships
Parents
NON_CONSOLIDATING (Direct Parent Exception reported)
NON_CONSOLIDATING (Ultimate Parent Exception reported)
Direct Children
Ultimate Children
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